Master of Science in Advanced Semiconductor Packaging
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OVERVIEW
Master of Science Program in Advanced Semiconductor Packaging involves 5 School/Center:
- School of Materials and Mineral Resources Engineering
- School of Electric and Electronic Engineering
- School of Mechanical Engineering
- Institute of Nano Optoelectronics Research and Technology (INOR)
- Collaborative Microelectronic Design Excellence Centre (CEDEC)
This program started based on collaboration activities with various semiconductor companies that produced high-end printed circuit board and integrated circuit substrates.
Core Courses
- EBB527 Advanced Material Characterisation for Semiconductor Packaging (4 Units)
- EBB528 Product Failure Analysis & Computational Aided Engineering (4 Units)
- EEE538 Science and Engineering Research Methodology (4 Units)
- EBB529 Advanced Chip-package-board Co-design (4 Units)
- EBB530 Research Project (24 Units)
Research Component
The research component requires candidates to select a research topic and carry out an intensive research study under the supervision of a lecturer.
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ADMISSION REQUIREMENTS
Applicants should possess the following:
A. BACHELOR'S DEGREE
- CGPA of at least 2.75 / 4.00; or
Applicants who clearly meet the entry requirements, namely those whose degrees are recognized in the fields of Science, Technology, and Engineering.
- CGPA between 2.50 - 2.74 with the following additional conditions:
Applications for Bachelor's Degrees in the fields of Science, Technology, and Engineering with a CGPA between 2.50–2.74 must meet one of the following criteria:
- Research experience for at least one year; or
- Work experience in related field for at least one year; or
- At least one (1) academic publication in the relevant field; or
- Grade B for major / elective courses; or
- Grade B+ for final year project
- CGPA between 2.00 - 2.49 (Bachelor's Degree with Honours) with the following additional conditions:
Applications for Bachelor's Degrees with Honours in the fields of Science, Technology, and Engineering with a CGPA between 2.00–2.49 must meet the following criteria:
- Research experience for at least five (5) years; or
- Work experience in related field for at least five (5) years; AND
- At least one (1) academic publication in the relevant field; or
- Grade B for major / elective courses; or
- Grade B+ for final year project
B. APEL A
Level 7 Qualification: https://apel.usm.my/
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LANGUAGE REQUIREMENTS
(Applicable for International Applicants Only)
The minimum score for each programme may vary from the list below. Candidates are required to check the specific programme requirements:
- A minimum of Band 5 for IELTS; or
- A minimum score of 40 for TOEFL (Internet-based); or
- A minimum of Band 7.5 for TOEFL Essentials (Online); or
- A minimum score of 154 for Cambridge English: Advanced (CAE) / Proficiency (CPE) /Preliminary (PET) / First (FCE) / Linguaskill Online (minimum score 154); or
- A minimum score of 47 for Pearson Test of English (PTE); or
- A minimum of Band 107 for CIEP Level (ELS); or
- A minimum of Band 3.5 for Malaysian University English Test (MUET)
Exemption is given to candidates if:
- English is the candidate’s mother tongue or national language; or
- The candidate graduated from an Institution of Higher Learning in which the medium of instruction at Bachelor and/or Master’s degree level is English (statement of proof required).
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DURATION
- Full-time: Min 2 semesters / Max 4 semesters
- Part-time: Min 4 semesters / Max 8 semesters
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SEMESTER INTAKE
OCTOBER Every Year
Teaching and learning will be conducted in a hybrid (blended learning) mode- Physical and online
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FEES
Malaysian (MYR)
International (USD) *
- Registration Fee: 330.00
- Tuition Fee: 600.00 X 40 Units = 24,000.00
- Thesis Evaluation Fee: 800.00
- Convocation Fee: 200.00
- Research Methodology: 320.00
- Registration Fees: 225.00
- Personal Bond: 1000.00
- Tuition Fees: 225.00 X 40 Units = 9,000.00
- Thesis Evaluation Fee: 800.00
- Convocation Fee: 50.00
- Research Methodology: 80.00
*Not inclusive 6% Sales and Service Tax (SST) imposed by Government of Malaysia
** Fees are subject to change